Author:Geert Van der Plas

Publications
Invited Paper: Opportunities of Chip Power Integrity and Performance Improvement Through Wafer Backside (BS) Connection Rongmei Chen, Giuliano Sisto, Odysseas Zografos, Dragomir Milojevic, Pieter Weckx, Geert Van der Plas and Eric Beyne EasyChair Preprint no. 9239