Analysis and Perspective of Thermal Interface Material Properties Under High Power Density Operating Conditions

EasyChair Preprint no. 13721

Abstract

With the integration of electronic devices, the continuous increase in power density, the emergence of high-power LEDs, and the continuation of Moore's Law, miniaturization of electronic product feature sizes inevitably leads to increased power density of electronic devices. Therefore, thermal conduction is gradually becoming a limiting factor in improving feature density. Due to the existence of contact thermal resistance between heating devices and heat dissipation structures, thermal interface materials are required to fill in order to reduce contact thermal resistance and enhance thermal conduction efficiency and pathways between materials interfaces. This paper investigates and experimentally measures three commonly used types of thermal interface materials—metallic solder, pads, and gels. It compares and analyzes the processing techniques, filling effects, and performance testing of 11 interface material samples. The results indicate that under conditions of a 500W high-power COB LED light source, four samples show superior thermal conductivity compared to thermal grease as the baseline. For metallic solder, the duration and temperature settings of each temperature zone in the process, as well as the environment inside the soldering furnace, significantly affect the soldering results. Improving the soldering process flow and adjusting the duration of each part of the process enhance soldering effects and reduce solder void rates. Process adjustments and improvements notably enhance soldering effects. Meeting the heat conduction needs of high-power and high-power density device thermal sources holds promising prospects for future applications in heat dissipation for high-power density devices.

Keyphrases: COB LEDs；, Contact thermal resistance；, Performance analysis；, Recommendations；, Thermal interface materials；

@Booklet{EasyChair:13721,
  author = {Chaoyue Liu and Cheng Ruan and Long Sun and Yaowei Huang and Yang Wang and Yu Cui},
  title = {Analysis and Perspective of Thermal Interface Material Properties Under High Power Density Operating Conditions},
  howpublished = {EasyChair Preprint no. 13721},

  year = {EasyChair, 2024}}