The Metaverse represents a transformation in which the physical and digital worlds, along with humans, and Artificial Intelligence, seamlessly converge in a symbiotic digital ecosystem. It integrates our personal and professional lives into a unified digital continuum, reshaping the industrial, economic, educational, and societal domains in profound ways. Organized by the IEEE Metaverse Initiative, the IEEE International Symposium on Emerging Metaverse invites authors to submit original, high-quality research papers.

Submission Guidelines

All papers must be original and not simultaneously submitted to another journal or conference. The following paper categories are welcome.

• Full papers describing original, unpublished, and not under concurrent review elsewhere. Paper length: 4 to 8 pages, including tables and figures (excluding references). Papers must adhere to IEEE conference format (see Authors Guidelines for LaTeX and Word templates).

• Abstracts describing short technical contributions, research prototypes, work-in-progress, or tools under development. The document should be a maximum of 800 words (excluding references) and no more than 2 pages (including references), including figures. Submissions must present original work that has not been previously published and is not under review elsewhere. Manuscript must adhere to the IEEE conference format.

List of Topics

• Topic 1: eXtended Reality (XR) and Immersive Technologies, Metaverse Systems Design and Architecture, Computer Vision Technologies Powering the Metaverse, Cloud/Edge/Fog/Accelerated Computing and Beyond.

• Topic 2: Artificial Intelligence, LLM-driven Virtual Characters and Systems, Ethical AI and Algorithmic Governance, Data Management, Processing, and Visualization.

• Topic 3: Digital Twins, Cyber-Physical Systems, Sensors, Internet of Everything, Interoperability and Cross-Platform Experiences, and Applications of Metaverse Technology (CityVerse, EduVerse, Industry 5.0, Healthcare, Social and Cultural, Sustainable & Ethical Metaverse etc.)

Committees

Program Committee

• Andriani Piki
• Pavana Prakash
• Mohamed Saeed Darweesh

Organizing Committee

• Jeewika Ranaweera
• Dejan Milojicic
• Louis Nisiotis

Publication

ISEMV 2026 proceedings will be published in IEEE Xplore. Authors are encouraged to share datasets via IEEE DataPort to enhance reproducibility and visibility.

Contact

All questions about submissions should be emailed to isemv@ieee.org