The International Symposium on Applied Science (ISAS), formerly was International Symposium on Engineering Physics and Mechanics (ISEPM) has been held every two years since 2011, aims to bring together researchers from different countries and to promote a synergy of collaborated research with the creation and exchange of ideas related to the applied science field.

The symposium program focuses on both fundamental and applied research in areas related to the applied science field. ISAS 2023 will cover aspects not only in the biomedical engineering, engineering physics, and engineering mechanics field but also applied mathematics, computational physics, and innovative technologies. We will strive hard to create a platform of collaborations and meetings where all the scientists, academicians, lab experts, industry people, and young researchers will meet at one place to share and gain knowledge through panel discussions, technical-scientific sessions, workshops, and poster presentations.

Along with sharing and gaining knowledge, the symposium also provides space for interactions where everyone will be given the freedom to interact and helps in making new international collaborations. The symposium will also provide the best opportunity for delegates and people from the industry to make new contacts where they can develop their products. In this regard, we warmly welcome you to join us for two days and make the symposium a successful one.

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Submission Guidelines

All papers must be original and not simultaneously submitted to another journal or conference. Contributions such as articles, reception desk, examination, resubmission, judgment, all the presentation of the last manuscript perform by the electronic contribution system (EasyChair) of this Symposium. All papers and presentations must be submitted in English.https://easychair.org/conferences/?conf=isas2023

The following paper categories are welcome:

• Full papers that highlight the recent trends in the research areas of biomedical engineering, engineering physics, and engineering mechanics field but also applied mathematics, computational physics, and innovative technologies. 
• Posters that are relevant to the symposium themes are to be presented in the poster session of the symposium.

More details: https://fas.hcmut.edu.vn/isas2023#contributors

List of Topics

• BIOMEDICAL ENGINEERING: Bioinstrumentations, Biomedical Imaging, Biomaterials, Bioinformatics
• ENGINEERING MECHANICS: Biomechanics, Mechanics of Solids, Structures and Fluids, Wave Propagation, Dynamics and Control, Heat Transfer, Thermal, and Fluid Engineering, Engineering Acoustics, Vibration Measurement, and Control, Fracture Mechanics
• ENGINEERING PHYSICS: LED Technology and Application, Medical Physics, Low-Level Laser Application, Photonic Application
• COMPUTATIONAL PHYSICS: Ab initio calculations, Molecular dynamics simulations, Monte Carlo Simulations, Multi-scale modeling and simulation, Modeling and algorithm development
• APPLIED MATHEMATICS: Applied Mathematics in Physics, Engineering, Economics, Medicine, Biology
• INNOVATIVE TECHNOLOGY: Agriculture, Waste Management, Artificial Intelligence, Alternative Health, Agile and rapid prototyping

Committees

Program Committee

• Minh Phuong LE, Ho Chi Minh City University of Technology, Vietnam
• Van Thang LE, Ho Chi Minh City University of Technology, Vietnam
• Koichi SHIMIZU, Waseda University, Japan
• Hirofumi TANAKA, Kyushu Institute of Technology, Japan
• Nobuki KUDO, Hokkaido University, Japan
• Gou-Jen WANG, National Chung Hsing University, Taiwan
• Congo Tak-Shing CHING, National Chung Hsing University, Taiwan
• Ming-Fa Lin, National Cheng Kung University, Taiwan
• Van Manh DINH, Institute of Mechanics - VAST, Vietnam
• Dinh Kien NGUYEN, Institute of Mechanics - VAST, Vietnam
• Tich Thien TRUONG, Ho Chi Minh City University of Technology, Vietnam
• Trung Nghia TRAN, Ho Chi Minh City University of Technology, Vietnam
• Xuan Dai LE, Ho Chi Minh City University of Technology, Vietnam
• Quang Linh HUYNH, HCMUT, Vietnam
• Cong Hoa VU, Ho Chi Minh City University of Technology, Vietnam
• Thanh Nha NGUYEN, Ho Chi Minh City University of Technology, Vietnam
• Tan Thi PHAM, Ho Chi Minh City University of Technology, Vietnam
• Thu Hanh TRAN, Ho Chi Minh City University of Technology, Vietnam
• Quoc Khai LE, Ho Chi Minh City University of Technology, Vietnam

Organizing committee

• - Collaborative Research Member -
• Koichi SHIMIZU, Xidian University, China
• Tanaka HIROFUMI, Kyushu Institute of Technology, Japan
• Takeshi NAMITA, Kyoto University, Japan
• Nobuki KUDO, Hokkaido University, Japan
• Yuji KATO, Hokkaido University, Japan
• Pham Trung Hieu NGUYEN, New Jersey Institute of Technology, USA
• Congo Tak-Shing CHING, National Chung Hsing University, Taiwan
• Ming-Fa Lin, National Cheng Kung University, Taiwan
• Dr. Pásztory ZOLTÁN, University of Sopron, Hungary
• Van Manh DINH, Institute of Mechanics - VAST, Vietnam
• Dinh Kien NGUYEN, Institute of Mechanics - VAST, Vietnam

• - Ho Chi Minh City University of Technology Member -
• Kieu Nhi NGO, Ho Chi Minh City University of Technology, Vietnam
• Tich Thien TRUONG, Ho Chi Minh City University of Technology, Vietnam
• Cong Hoa VU, Ho Chi Minh City University of Technology, Vietnam
• Van Hoang VO, Ho Chi Minh City University of Technology, Vietnam
• Quang Linh HUYNH, Ho Chi Minh City University of Technology, Vietnam
• Trung Nghia TRAN, Ho Chi Minh City University of Technology, Vietnam
• Tan Thi PHAM, Ho Chi Minh City University of Technology, Vietnam
• Ngoc Son DO, Ho Chi Minh City University of Technology, Vietnam
• Thu Hanh TRAN, Ho Chi Minh City University of Technology, Vietnam
• Dinh Huy NGUYEN, Ho Chi Minh City University of Technology, Vietnam
• Xuan Dai LE, Ho Chi Minh City University of Technology, Vietnam
• Tien Dung NGUYEN, Ho Chi Minh City University of Technology, Vietnam
• Thanh Nha NGUYEN, Ho Chi Minh City University of Technology, Vietnam
• Quoc Khai LE, Ho Chi Minh City University of Technology, Vietnam

Invited Speakers

• Congo Tak-Shing CHING, National Chung Hsing University, Taiwan
• Dr. Pásztory ZOLTÁN, University of Sopron, Hungary

Publication

ISAS 2023 Accepted Papers (after the peer-review process) will be published in Proceedings by Kalpa Publications in Engineering Series ISSN: 2515-1770 and Selected Papers will be published in Journal of Science and Technology Development ISSN: 1859-0128

Venue

The conference will be held in Ho Chi Minh City University of Technology (HCMUT), Ho Chi Minh City, Vietnam

The Campus Ly Thuong Kiet:Address: 268 Ly Thuong Kiet St., Ward 14, District 10, Ho Chi Minh City, VietnamGoogle Map Direction: https://goo.gl/maps/mSpekYMrhY72

Contact

All questions about submissions should be emailed to: fas@hcmut.edu.vn

Sponsors

Y Viet Trading And Service Co., Ltd., iMed Medical Equipment Co. Ltd., Archmediz Co. Ltd., VBS Tech Co. Ltd.