ICICM 2023: International Conference on Integrated Circuits and Microsystems Nanjing University of Posts&Telecommunications Nanjing, China, October 20-23, 2023

Conference website	http://icicm.net/
Submission link	https://easychair.org/conferences/?conf=icicm2023
Submission deadline	June 15, 2023

ICICM is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs. Integrated circuit plays a vital role in electronic information era, which now is becoming a first-class discipline in China. In order to promote the development of ICs, ICICM provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.The previous 7 editions ICICM have been successfully held in Chengdu on November 23-25, 2016; in Nanjing on November 8-11, 2017; in Shanghai on November 24-26, 2018; in Beijing on October 25-27,2019 and in Nanjing on October 23-25, 2020 and Oct 22-24, 2021, as well as October 28-31 in 2022. On the basis of success of the previous 7 year, we are proud to announce 2023 The 8th International Conference on Integrated Circuits and Microsystems (ICICM 2023) will be held in Nanjing, China on October 20-23, 2023, which is co-sponsored by Southeast University, China and University of Electronic Science and Technology of China, Nanjing University of Posts and Telecommunications, and technically assisted by by many local and international universities.

Submission Guidelines

Preparation of the Manuscript

1. All manuscripts must be written in English.

2. The minimum page limit for all manuscripts is 4 full pages, and the maximum page limit is 10 pages. When it exceeds 6 pages, each additional page will be chargeable. These limits include all figures, tables, and references. All manuscripts must be formatted in conference proceedings – Letter paper size, two columns format.

3. Manuscripts should state clearly and concisely the problem, methodology used and central conclusions, and may include figures and graphs.

4. Manuscripts must include a bibliography to help reviewers place the contributions of the work into context.

5. Template Download in word  Template Download in Latex

Submission of the Manuscript

1. Electronic Paper Submission

 

Submit your manuscripts via the below link:https://easychair.org/conferences/?conf=icicm2023

Should you have any questions about the submission, please feel free to contact us via icicm_conf@vip.163.com.Your submitted manuscript will be visually inspected by our submission system staff to assure that the document is readable and meets all formatting requirements to be included in a visually pleasing and consistent proceedings publication for ICICM. If our staff encounter errors with your submitted file, they will contact you to resolve the issue. If your paper passes inspection, it will be entered into the technical review process. A committee of reviewers selected by the conference committee will review the manuscripts and rate them according to relevance, contribution and originality. The technical program committee will use these reviews to determine which papers will be accepted for presentation in the conference. The result of the technical committee's decision will be communicated to all authors by email, along with the review form.

2. Notification of Acceptance

Authors will be notified of paper acceptance or rejection by email as close as possible to the published author notification date.The notification email will include comments from the reviewers and/or program committee members. The conference cannot guarantee that all of the reviewers will provide the level of detail desired by you. However, reviewers are encouraged to submit as detailed comments as possible.

3. Academic Ethics

Articles submitted to the conference should report original, previously unpublished research results, experimental or theoretical and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Any act of plagiarism is a totally unacceptable academic misconduct and cannot be tolerated. If plagiarism is found, the following acts of sanction will be taken:1). Reject the article submitted or delete the article from the final publications.2). Report the authors violation to his/her supervisor(s) and affiliated institution(s)3). Report the authors violation to the appropriate overseeing office of academic ethics and research funding agency.4). Reserve the right to publish the authors name(s), the title of the article, the name(s) of the affiliated institution and the details of misconduct, etc. of the plagiarist”

List of Topics

• Devices and Circuits for Wirless System
• Application Specific Circuits and Systems for Communication
• Digital, Analog, Mixed Signal IC and SOC design technology
• Silicon integrated circuits and manufacturing
• Low-power, RF devices & circuits
• IC Computer-Aided –Design technology, DFM
• Silicon/germanium devices and device physics
• Interconnect, Low K, High K and other process technologies
• Unconventional and nano-electronics
• Organic semiconductor devices and technologies
• ...etc

Committees

Advisory Chair

Ljiljana Trajkovic, Simon Fraser University, Canada

Conference Chairs

Zhigong Wang, Southeast University, China

Qiang Li, University of Electronic Science and Technology of China, China

Huimin Du, Xi'an University of Posts&Telecommunications, China

Program Chairs

Jiliang Zhang, Hunan University, China

Shengbing Zhang, Northwestern Polytechnical University, China

Huiyong Hu, Xidian University, China

Junwei Du, Qingdao University of Science and Technology, China

Shulin Liu, Xi'an University of Science and Technology, China

Ning Xu, Wuhan University of Technology, ChinaJun Cheng, Xi'an Jiaotong University, China

Yasuo Watanabe, Institute of Electronics, Information and Communication Engineers (IEICE), Japan

Invited Speakers

• Speaker 1 Prof. Pui-in Mak, IEEE Fellow, IET Fellow, RSC Fellow University of Macau, Macau, China, Chinese Academy of Sciences Overseas Expert
• Speaker 2 Prof. Ljiljana Trajkovic, IEEE Fellow, Simon Fraser University, Canada 
• Speaker 3 Prof. Jin He,Peking University, China 
• Speaker 4 Prof. Abdel Hamid Soliman,Staffordshire University, UK 

Publication

Submitted papers will be Peer-Reviewed (Double Blind) and the accepted ones will be collected in the conference proceedings and indexed by EI Compendex and Scopus, etc.

Venue

Nanjing University of Posts&Telecommunications

Contact

Ms. Jenny Chow

Email: icicm_conf@vip.163.com 

Tel：(86)136-2777-7774

You will get the reply within 2 workdays. If you need urgent reply, you can call us.